Custom Optoelectronics Products

Reduce your overall system cost and time to market while improving product performance and reliability by leveraging the OptoElectronix team's history of over 30 years of custom optoelectronic product design, materials technology, and cost-competitive, high-quality assembly expertise.

OptoElectronix enables you to reduce your overall system and program costs through higher levels of integration, lower component costs, reduced component inventory, just-in-time delivery, elimination of in-house assembly labor costs and lower administrative costs. Your ultimate advantage is leadership in your market by offering uniquely competitive products.

Design Expertise

OptoElectronix evaluates your overall system requirements to ensure our custom product designs provide optimal combined cost and performance. Our design capabilities include:

LED Material Selection and Specification

OptoElectronix globally sources the best LED technology available for the application based on specific device performance, quality, reliability and cost requirements.

LED Lens Evaluation and Design

We evaluate and design the full range of optical quality, from high-precision lenses as well as plastic optical lenses, to match lens features to your design's requirements.

LED Package Design

OptoElectronix offers full custom package design, including complex hybrid system capability. Improvements in size reduction, product performance, reliability and cost can all be realized through custom packaging.

To optimize the cost/performance benefit to you, OptoElectronix provides the flexibility of designing with a wide range of technologies, including hybrid chip-on-board (COB), PCB, flex circuit, custom leadframes, molded packages and plastic optics. We have extensive experience with air gap, conformal coating, and epoxy-encapsulated modules, including metal and plastic housings.

In addition to visible LEDs we have extensive experience in designing packaging for infrared (IR) LEDs, photodiodes, phototransistors, LSI CMOS ICs, bipolar ICs, optocouplers and discrete components.

Hybrid Packaging

Our hybrid packaging capability includes precision die attach and wire bonding in single-unit and array manufacturing processes. Chip-on-board (COB) can also include surface-mount technology (SMT) and through-hole PCB in the same hybrid design.

Design for Manufacturability

Concurrent engineering and design-for-manufacturability (DFM) practices accelerate the time to manufacturing and therefore the time to market. Design centers are maintained in Silicon Valley as well as in Penang, Malaysia.

Optical Metrology

We perform precise optical measurement as well as optical simulations.

Manufacturing Expertise

Manufacturing is based in Penang, Malaysia. The staff has extensive experience in optoelectronics manufacturing having spent decades in building up and managing the major optoelectronics factories on the island.